Chinese English
 
ADVANCED Service
Non-Destructive Analysis
Destructive Analysis
Chemical Handling
FIB Service
Reliability Service
ESD/HBM/MM
Solderability Test
Grinding/Polishing Consumables
 
    FIB Service
Test Pad/Probing Pad Building
 
测试键生长(Test Pad/Probing Pad Building)
 
在复杂线路中任意位置镀出测试键, 工程师可进一步使用探针台(Probe station) 或 E-beam 直接观测IC内部信号.
 
Back>>
 
Copyright © 2012 ADVANCED,Technical Support:HUICHENG